Electronics
A multitude of applications including broken wedge bonds, lifted ball bonds, wire sweep and die attach, surface mount defects, solder joint porosity, bridging, through hole plating and multi-layer alignment. BGA and CSP inspection, dry joints (Insufficient solder), bridging/shorts (surplus solder), voiding ,misplacement, misalignment, etc. x-ray and computed tomography ct are commonly used for this inspection.
